NVMFS5C430NLT1G
vs
NVMFS5C430NT1G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
End Of Life
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
ONSEMI
|
| Package Description |
SMALL OUTLINE, R-PDSO-F5
|
|
| Manufacturer Package Code |
488AA
|
488AA
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Samacsys Manufacturer |
onsemi
|
onsemi
|
| Avalanche Energy Rating (Eas) |
493 mJ
|
338 mJ
|
| Case Connection |
DRAIN
|
DRAIN
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
40 V
|
40 V
|
| Drain-source On Resistance-Max |
0.0022 Ω
|
0.0017 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-30 Code |
R-PDSO-F5
|
R-PDSO-F6
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
5
|
6
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Pulsed Drain Current-Max (IDM) |
900 A
|
900 A
|
| Reference Standard |
AEC-Q101
|
AEC-Q101
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
2 Days
|
| Drain Current-Max (ID) |
|
185 A
|
| Feedback Cap-Max (Crss) |
|
45 pF
|
| Operating Temperature-Max |
|
175 °C
|
| Power Dissipation-Max (Abs) |
|
106 W
|
|
|
|
Compare NVMFS5C430NLT1G with alternatives
Compare NVMFS5C430NT1G with alternatives