NTGS3455T1
vs
ZXMN3A04DN8TA
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ZETEX PLC
|
Part Package Code |
TSOP
|
|
Package Description |
MINIATURE, CASE 318G-02, TSOP-6
|
SOIC-8
|
Pin Count |
6
|
|
Manufacturer Package Code |
CASE 318G-02
|
|
Reach Compliance Code |
unknown
|
unknown
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
30 V
|
30 V
|
Drain Current-Max (ID) |
2.5 A
|
6.5 A
|
Drain-source On Resistance-Max |
0.1 Ω
|
0.02 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G8
|
JESD-609 Code |
e0
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
2
|
Number of Terminals |
6
|
8
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
240
|
260
|
Polarity/Channel Type |
P-CHANNEL
|
N-CHANNEL
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
EAR99
|
JEDEC-95 Code |
|
MS-012AA
|
|
|
|
Compare NTGS3455T1 with alternatives
Compare ZXMN3A04DN8TA with alternatives