NTE9370 vs HD74HC75P feature comparison

NTE9370 NTE Electronics Inc

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HD74HC75P Renesas Electronics Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NTE ELECTRONICS INC RENESAS ELECTRONICS CORP
Part Package Code DIP DIP
Package Description , DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 9370 HC/UH
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Logic IC Type D FLIP-FLOP D LATCH
Number of Bits 4 2
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 13 V 6 V
Supply Voltage-Min (Vsup) 11 V 2 V
Supply Voltage-Nom (Vsup) 12 V 4.5 V
Surface Mount NO NO
Temperature Grade OTHER INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE HIGH LEVEL
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Length 19.2 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code DIP16,.3
Prop. Delay@Nom-Sup 31 ns
Propagation Delay (tpd) 180 ns
Seated Height-Max 5.06 mm
Technology CMOS
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare NTE9370 with alternatives

Compare HD74HC75P with alternatives