NT5TU256M4GE-AC
vs
K4T1G044QE-HCLE7
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NANYA TECHNOLOGY CORP
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
TFBGA,
|
TFBGA,
|
Pin Count |
60
|
60
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.32
|
8542.32.00.32
|
Access Mode |
MULTI BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
Access Time-Max |
0.4 ns
|
0.4 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
JESD-30 Code |
R-PBGA-B60
|
R-PBGA-B60
|
Length |
10 mm
|
9.5 mm
|
Memory Density |
1073741824 bit
|
1073741824 bit
|
Memory IC Type |
DDR2 DRAM
|
DDR DRAM
|
Memory Width |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
60
|
60
|
Number of Words |
268435456 words
|
268435456 words
|
Number of Words Code |
256000000
|
256000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
95 °C
|
Operating Temperature-Min |
|
|
Organization |
256MX4
|
256MX4
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Self Refresh |
YES
|
YES
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
8 mm
|
7.5 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare NT5TU256M4GE-AC with alternatives
Compare K4T1G044QE-HCLE7 with alternatives