NT5SV16M16BS-75B
vs
HY5V56BF-HI
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NANYA TECHNOLOGY CORP
|
SK HYNIX INC
|
Part Package Code |
TSOP2
|
BGA
|
Package Description |
TSOP2, TSOP54,.46,32
|
FBGA, BGA54,9X9,32
|
Pin Count |
54
|
54
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.24
|
8542.32.00.24
|
Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
Access Time-Max |
5.4 ns
|
5.4 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
Clock Frequency-Max (fCLK) |
133 MHz
|
133 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
1,2,4,8
|
1,2,4,8
|
JESD-30 Code |
R-PDSO-G54
|
R-PBGA-B54
|
Length |
22.22 mm
|
13.5 mm
|
Memory Density |
268435456 bit
|
268435456 bit
|
Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
54
|
54
|
Number of Words |
16777216 words
|
16777216 words
|
Number of Words Code |
16000000
|
16000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
16MX16
|
16MX16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSOP2
|
FBGA
|
Package Equivalence Code |
TSOP54,.46,32
|
BGA54,9X9,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
8192
|
8192
|
Seated Height-Max |
1.2 mm
|
1.07 mm
|
Self Refresh |
YES
|
YES
|
Sequential Burst Length |
1,2,4,8
|
1,2,4,8,FP
|
Standby Current-Max |
0.002 A
|
0.001 A
|
Supply Current-Max |
0.18 mA
|
0.22 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
10.16 mm
|
8 mm
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e1
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare NT5SV16M16BS-75B with alternatives
Compare HY5V56BF-HI with alternatives