NT5DS32M8AW-75B
vs
MT46V32M8BJ-75EH
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NANYA TECHNOLOGY CORP
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
TBGA, BGA60,9X12,40/32
TBGA,
Pin Count
60
60
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.24
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.75 ns
0.75 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4,8
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e0
e1
Length
15.5 mm
16 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
DDR1 DRAM
DDR1 DRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32MX8
32MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Equivalence Code
BGA60,9X12,40/32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
8192
Seated Height-Max
1.15 mm
1.2 mm
Self Refresh
YES
YES
Sequential Burst Length
2,4,8
Standby Current-Max
0.025 A
Supply Current-Max
0.3 mA
0.16 mA
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
8.5 mm
9 mm
Base Number Matches
1
1
Compare NT5DS32M8AW-75B with alternatives
Compare MT46V32M8BJ-75EH with alternatives