NT5DS32M16AF-75B vs V58C2512164SDLJ36 feature comparison

NT5DS32M16AF-75B Nanya Technology Corporation

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V58C2512164SDLJ36 ProMOS Technologies Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NANYA TECHNOLOGY CORP PROMOS TECHNOLOGIES INC
Part Package Code BGA DSBGA
Package Description BGA, BGA60,9X12,40/32 TBGA,
Pin Count 60 60
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 0.75 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code S-PBGA-B60 R-PBGA-B60
Length 12.5 mm 12 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type DDR1 DRAM DDR DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32MX16 32MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TBGA
Package Equivalence Code BGA60,9X12,40/32
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.15 mm 1.2 mm
Self Refresh YES YES
Sequential Burst Length 2,4,8
Standby Current-Max 0.018 A
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 12.5 mm 10 mm
Base Number Matches 1 1

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Compare V58C2512164SDLJ36 with alternatives