NT5CC128M16JR-EKI
vs
MYX4DDR3L128M16JT-125
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NANYA TECHNOLOGY CORP
MICROSS COMPONENTS
Package Description
TFBGA-96
TFBGA,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Date Of Intro
2017-11-30
Samacsys Manufacturer
Nanya
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
JESD-609 Code
e1
Length
13 mm
14 mm
Memory Density
2147483648 bit
2147483648 bit
Memory IC Type
DDR DRAM
DDR3L DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
96
96
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
95 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128MX16
128MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.45 V
1.45 V
Supply Voltage-Min (Vsup)
1.283 V
1.283 V
Supply Voltage-Nom (Vsup)
1.35 V
1.35 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.5 mm
8 mm
Base Number Matches
1
1
Compare NT5CC128M16JR-EKI with alternatives
Compare MYX4DDR3L128M16JT-125 with alternatives