NSBMC096VF30
vs
NSBMC096VF16
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
BQFP,
GQFP, SPQFP132,1.1SQ
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
29
Boundary Scan
NO
NO
Bus Compatibility
I960CA; I960CF
I960CA; I960CF
Clock Frequency-Max
30 MHz
16 MHz
External Data Bus Width
JESD-30 Code
S-PQFP-G132
S-PQFP-G132
Length
24.13 mm
24.13 mm
Low Power Mode
NO
NO
Memory Organization
64M X 1
16M X 1
Number of Banks
4
4
Number of Terminals
132
132
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BQFP
GQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, BUMPER
FLATPACK, GUARD RING
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
4.45 mm
Supply Current-Max
100 mA
100 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
24.13 mm
24.13 mm
uPs/uCs/Peripheral ICs Type
MEMORY CONTROLLER, DRAM
MEMORY CONTROLLER, DRAM
Base Number Matches
2
2
Rohs Code
No
JESD-609 Code
e0
Package Equivalence Code
SPQFP132,1.1SQ
Terminal Finish
Tin/Lead (Sn/Pb)
Compare NSBMC096VF30 with alternatives
Compare NSBMC096VF16 with alternatives