NRCP50J101TRF
vs
TSR2GJ101V
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
NIC COMPONENTS CORP
TATEYAMA KAGAKU GROUP
Package Description
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Construction
Chip
Chip
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
5 mm
5 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.5 mm
2.5 mm
Packing Method
TR
Tape
Rated Power Dissipation (P)
0.75 W
0.75 W
Rated Temperature
70 °C
Resistance
100 Ω
100 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
200 V
200 V
Base Number Matches
1
1
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Compare TSR2GJ101V with alternatives