NPIC6C595BQ,115
vs
NPIC6C595BQ
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NEXPERIA
|
Part Package Code |
QFN
|
|
Package Description |
2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT763-1, DHVQFN-16
|
DHVQFN-16
|
Pin Count |
16
|
|
Manufacturer Package Code |
SOT763-1
|
|
Reach Compliance Code |
compliant
|
compliant
|
Count Direction |
RIGHT
|
RIGHT
|
Family |
NPIC
|
NPIC
|
JESD-30 Code |
R-PQCC-N16
|
R-PQCC-N16
|
Length |
3.5 mm
|
3.5 mm
|
Logic IC Type |
SERIAL IN SERIAL OUT
|
SERIAL IN PARALLEL OUT
|
Max Frequency@Nom-Sup |
10000000 Hz
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC16,.1X.14,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
2.5 mm
|
2.5 mm
|
Base Number Matches |
2
|
2
|
HTS Code |
|
8542.39.00.01
|
JESD-609 Code |
|
e4
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
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