NMC27C512QM350 vs MD27512-25 feature comparison

NMC27C512QM350 Rochester Electronics LLC

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MD27512-25 Intel Corporation

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC INTEL CORP
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Memory IC Type UVPROM UVPROM
Base Number Matches 3 2
Rohs Code No
Package Description DIP-28
Access Time-Max 250 ns
I/O Type COMMON
JESD-30 Code R-XDIP-T28
JESD-609 Code e0
Memory Density 524288 bit
Memory Width 8
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Supply Current-Max 0.15 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology MOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

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