NMC2147HJ-1
vs
AM10470-15FMB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DFP
Package Description
DIP, DIP18,.3
DFP, FL18,.3
Pin Count
18
18
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
15 ns
I/O Type
SEPARATE
SEPARATE
JESD-30 Code
R-GDIP-T18
R-GDFP-F18
JESD-609 Code
e0
e0
Memory Density
4096 bit
4096 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
18
18
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
4KX1
4KX1
Output Characteristics
3-STATE
OPEN-EMITTER
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DFP
Package Equivalence Code
DIP18,.3
FL18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
2.286 mm
Standby Voltage-Min
4.5 V
Supply Current-Max
0.18 mA
0.255 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
YES
Technology
NMOS
ECL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
9.525 mm
Base Number Matches
2
1
Length
9.779 mm
Screening Level
MIL-STD-883 Class B (Modified)
Compare NMC2147HJ-1 with alternatives
Compare AM10470-15FMB with alternatives