NM24C09M8X vs M24C64-WDW6TGB feature comparison

NM24C09M8X Texas Instruments

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M24C64-WDW6TGB STMicroelectronics

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Part Life Cycle Code Transferred Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP STMICROELECTRONICS
Part Package Code SOIC SOIC
Package Description SOP, TSSOP,
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Additional Feature 16 BYTE PAGE WRITE; WRITE PROTECT; DATA RETENTION>40 YEARS
Clock Frequency-Max (fCLK) 0.4 MHz 0.4 MHz
Data Retention Time-Min 40
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm 4.4 mm
Memory Density 8192 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1024 words 8192 words
Number of Words Code 1000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1KX8 8KX8
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.2 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 2.5 V
Supply Voltage-Nom (Vsup) 5 V 2.7 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3 mm
Write Cycle Time-Max (tWC) 10 ms 5 ms
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

Compare NM24C09M8X with alternatives

Compare M24C64-WDW6TGB with alternatives