NLV74HCT32ADTR2G
vs
TC74HC32AFN-TP2ELP
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
TOSHIBA CORP
|
| Package Description |
TSSOP-14
|
SOP,
|
| Manufacturer Package Code |
948G
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
2 Days
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Family |
HCT
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e4
|
e2
|
| Length |
5 mm
|
8.65 mm
|
| Logic IC Type |
OR GATE
|
OR GATE
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
22 ns
|
19 ns
|
| Seated Height-Max |
1.2 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN COPPER/TIN SILVER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| Load Capacitance (CL) |
|
50 pF
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare NLV74HCT32ADTR2G with alternatives
Compare TC74HC32AFN-TP2ELP with alternatives