NLU1GU04AMX1TCG
vs
NC7ST08L6X
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ONSEMI
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
SOIC
MICROPAK MLP
Package Description
1.45 X 1 MM, 0.50 MM PITCH, LEAD FREE, ULLGA-6
1 MM, MICROPAK-6
Pin Count
6
6
Manufacturer Package Code
613AF
6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED)
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
1G
HST/T
JESD-30 Code
R-PDSO-N6
R-PDSO-N6
JESD-609 Code
e4
e4
Length
1.45 mm
1.45 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
INVERTER
AND GATE
Max I(ol)
0.004 A
0.002 A
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
1
2
Number of Terminals
6
6
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
VSON
Package Equivalence Code
SOLCC6,.04,20
SOLCC6,.04,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
15.5 ns
31 ns
Propagation Delay (tpd)
15.5 ns
31 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
0.4 mm
0.55 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
1 mm
1 mm
Base Number Matches
1
3
ECCN Code
EAR99
Time@Peak Reflow Temperature-Max (s)
30
Compare NLU1GU04AMX1TCG with alternatives
Compare NC7ST08L6X with alternatives