NLSV4T244MUTAG
vs
NLSV4T3234FCT1G
feature comparison
Pbfree Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ONSEMI
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
UQFN12 2.0x1.7, 0.4P
|
BGA
|
Package Description |
UQFN-12
|
1.41 X 2.04 MM, ROHS COMPLIANT, FLIP-CHIP-11
|
Pin Count |
12
|
11
|
Manufacturer Package Code |
523AE
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
17 Weeks
|
|
Samacsys Manufacturer |
onsemi
|
|
Family |
4T
|
4T
|
JESD-30 Code |
R-XQCC-N12
|
R-PBGA-B11
|
JESD-609 Code |
e4
|
e3
|
Length |
2 mm
|
2.04 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
Number of Bits |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
12
|
11
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
3.3 ns
|
5.6 ns
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
0.55 mm
|
0.66 mm
|
Supply Voltage-Max (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Min (Vsup) |
0.9 V
|
0.9 V
|
Supply Voltage-Nom (Vsup) |
1.2 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
1.7 mm
|
1.41 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare NLSV4T244MUTAG with alternatives
Compare NLSV4T3234FCT1G with alternatives