NLAS5223CLMUTAG
vs
ADG820BRM
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
ANALOG DEVICES INC
|
| Manufacturer Package Code |
488AT
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
onsemi
|
Analog Devices
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-609 Code |
e4
|
e0
|
| Moisture Sensitivity Level |
1
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
TSSOP, TSSOP8,.19
|
| Pin Count |
|
8
|
| JESD-30 Code |
|
S-PDSO-G8
|
| Length |
|
3 mm
|
| Number of Channels |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Off-state Isolation-Nom |
|
71 dB
|
| On-state Resistance Match-Nom |
|
0.06 Ω
|
| On-state Resistance-Max (Ron) |
|
1.4 Ω
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP8,.19
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.09 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Surface Mount |
|
YES
|
| Switch-off Time-Max |
|
45 ns
|
| Switch-on Time-Max |
|
35 ns
|
| Switching |
|
MAKE-BEFORE-BREAK
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
3 mm
|
|
|
|
Compare NLAS5223CLMUTAG with alternatives
Compare ADG820BRM with alternatives