NIN-HJ330GTRF
vs
0603WL330GT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Transferred
|
Ihs Manufacturer |
NIC COMPONENTS CORP
|
AMERICAN TECHNICAL CERAMICS CORP
|
Package Description |
CHIP, 0603
|
CHIP
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8504.50.80.00
|
8504.50.80.00
|
Case/Size Code |
0603
|
0603
|
Construction |
Chip
|
Rectangular
|
DC Resistance |
0.22 Ω
|
0.22 Ω
|
Inductance-Nom (L) |
0.033 µH
|
0.033 µH
|
Inductor Application |
HIGH CURRENT INDUCTOR
|
RF INDUCTOR
|
Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
JESD-609 Code |
e3
|
e3
|
Number of Functions |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Height |
1.02 mm
|
1.02 mm
|
Package Length |
1.8 mm
|
1.8 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
1.12 mm
|
1.12 mm
|
Packing Method |
TR, Embossed, 7 Inch
|
TR, Embossed
|
Quality Factor-Min (at L-nom) |
35
|
40
|
Rated Current-Max |
0.6 A
|
0.6 A
|
Self Resonance Frequency |
2300 MHz
|
2300 MHz
|
Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
Shielded |
NO
|
NO
|
Special Feature |
Q MEASURED@250MHZ
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
Tin (Sn) - with Nickel (Ni) barrier
|
Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
Terminal Shape |
ONE SURFACE
|
WRAPAROUND
|
Test Frequency |
250 MHz
|
250 MHz
|
Tolerance |
2%
|
2%
|
Base Number Matches |
1
|
2
|
Core Material |
|
CERAMIC
|
|
|
|
Compare NIN-HJ330GTRF with alternatives