NIMD6302R2
vs
2N3956
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
CENTRAL SEMICONDUCTOR CORP
|
Part Package Code |
SOT
|
TO-71
|
Package Description |
CASE 751-07, SOIC-8
|
TO-71, 8 PIN
|
Pin Count |
8
|
8
|
Manufacturer Package Code |
CASE 751-07
|
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
Factory Lead Time |
4 Weeks
|
|
Additional Feature |
ESD PROTECTED
|
|
Case Connection |
ISOLATED
|
|
Configuration |
COMPLEX
|
|
DS Breakdown Voltage-Min |
30 V
|
|
Drain Current-Max (ID) |
6.5 A
|
|
Drain-source On Resistance-Max |
0.05 Ω
|
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
JUNCTION
|
Feedback Cap-Max (Crss) |
200 pF
|
|
JESD-30 Code |
R-PDSO-G8
|
O-XBCY-W8
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
4
|
|
Number of Terminals |
8
|
8
|
Operating Mode |
ENHANCEMENT MODE
|
DEPLETION MODE
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
SMALL OUTLINE
|
CYLINDRICAL
|
Peak Reflow Temperature (Cel) |
235
|
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
1.67 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
WIRE
|
Terminal Position |
DUAL
|
BOTTOM
|
Transistor Application |
SWITCHING
|
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
JEDEC-95 Code |
|
TO-71
|
Operating Temperature-Max |
|
200 °C
|
|
|
|
Compare NIMD6302R2 with alternatives
Compare 2N3956 with alternatives