NG80960KA-16
vs
MC68020FC33E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
MOTOROLA INC
Part Package Code
QFP
Package Description
PLASTIC, QFP-132
QFP, QFP132,1.2SQ
Pin Count
132
Reach Compliance Code
unknown
unknown
Additional Feature
OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; BURST BUS
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
32 MHz
33 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
YES
JESD-30 Code
S-PQFP-G132
S-PQFP-G132
JESD-609 Code
e0
e0
Length
24.13 mm
24.13 mm
Low Power Mode
NO
NO
Number of DMA Channels
Number of External Interrupts
4
7
Number of Serial I/Os
Number of Terminals
132
132
On Chip Data RAM Width
Operating Temperature-Max
100 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BQFP
QFP
Package Equivalence Code
SPQFP132,1.1SQ
QFP132,1.2SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, BUMPER
FLATPACK
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5 V
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
0
Seated Height-Max
4.57 mm
4.572 mm
Speed
16 MHz
33 MHz
Supply Current-Max
315 mA
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
HCMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
24.13 mm
24.13 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
4
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
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