NG80960JA-25 vs 5962F0150202QYC feature comparison

NG80960JA-25 Intel Corporation

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5962F0150202QYC Cobham Semiconductor Solutions

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP AEROFLEX COLORADO SPRINGS
Part Package Code QFP PGA
Package Description BQFP, SPQFP132,1.1SQ PGA,
Pin Count 132 144
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature OPERATING CASE TEMPERATURE 0 TO 100 C
Address Bus Width 32 16
Bit Size 32 32
Boundary Scan YES NO
Clock Frequency-Max 25 MHz 16 MHz
External Data Bus Width 32 16
Format FIXED POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-PQFP-G132 S-CPGA-P144
JESD-609 Code e0 e4
Length 24.13 mm 39.75 mm
Low Power Mode YES YES
Number of Terminals 132 144
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code BQFP PGA
Package Equivalence Code SPQFP132,1.1SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, BUMPER GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.572 mm
Speed 25 MHz 16 MHz
Supply Current-Max 260 mA
Supply Voltage-Max 3.45 V 5.5 V
Supply Voltage-Min 3.15 V 4.5 V
Supply Voltage-Nom 3.3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Terminal Finish TIN LEAD GOLD
Terminal Form GULL WING PIN/PEG
Terminal Pitch 0.635 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Width 24.13 mm 39.75 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Screening Level MIL-PRF-38535 Class Q
Temperature Grade MILITARY
Total Dose 300k Rad(Si) V

Compare NG80960JA-25 with alternatives

Compare 5962F0150202QYC with alternatives