NG80960JA-25
vs
5962F0150202QYC
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
AEROFLEX COLORADO SPRINGS
|
Part Package Code |
QFP
|
PGA
|
Package Description |
BQFP, SPQFP132,1.1SQ
|
PGA,
|
Pin Count |
132
|
144
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
OPERATING CASE TEMPERATURE 0 TO 100 C
|
|
Address Bus Width |
32
|
16
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
NO
|
Clock Frequency-Max |
25 MHz
|
16 MHz
|
External Data Bus Width |
32
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
NO
|
JESD-30 Code |
S-PQFP-G132
|
S-CPGA-P144
|
JESD-609 Code |
e0
|
e4
|
Length |
24.13 mm
|
39.75 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
132
|
144
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BQFP
|
PGA
|
Package Equivalence Code |
SPQFP132,1.1SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, BUMPER
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.572 mm
|
Speed |
25 MHz
|
16 MHz
|
Supply Current-Max |
260 mA
|
|
Supply Voltage-Max |
3.45 V
|
5.5 V
|
Supply Voltage-Min |
3.15 V
|
4.5 V
|
Supply Voltage-Nom |
3.3 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN LEAD
|
GOLD
|
Terminal Form |
GULL WING
|
PIN/PEG
|
Terminal Pitch |
0.635 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
PERPENDICULAR
|
Width |
24.13 mm
|
39.75 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
3A001.A.2.C
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Screening Level |
|
MIL-PRF-38535 Class Q
|
Temperature Grade |
|
MILITARY
|
Total Dose |
|
300k Rad(Si) V
|
|
|
|
Compare NG80960JA-25 with alternatives
Compare 5962F0150202QYC with alternatives