NG80386SX-33
vs
VY86C06020FC-2
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
BQFP, SPQFP100,.9SQ
|
QFP, QFP100,.7X.9
|
| Pin Count |
100
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
66 MHz
|
|
| External Data Bus Width |
16
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-PQFP-G100
|
R-PQFP-G100
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.05 mm
|
|
| Low Power Mode |
NO
|
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
2
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
100
|
100
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
100 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BQFP
|
QFP
|
| Package Equivalence Code |
SPQFP100,.9SQ
|
QFP100,.7X.9
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, BUMPER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
4.57 mm
|
|
| Speed |
33 MHz
|
20 MHz
|
| Supply Current-Max |
380 mA
|
72 mA
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
19.05 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
|
|
|
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