NG80386SX-25/F
vs
79R3041-25PFG8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
GQFF, TAPEPAK,100P,.025
LFQFP, QFP100,.63SQ,20
Pin Count
100
100
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
BARREL SHIFTER; ADDER
BURST BUS; 5 PIPELINE STAGES
Address Bus Width
24
32
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
50 MHz
50 MHz
External Data Bus Width
16
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-PQFP-F100
S-PQFP-G100
JESD-609 Code
e0
e3
Length
19 mm
14 mm
Low Power Mode
NO
NO
Number of DMA Channels
Number of External Interrupts
2
Number of Serial I/Os
Number of Terminals
100
100
On Chip Data RAM Width
Operating Temperature-Max
100 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
GQFF
LFQFP
Package Equivalence Code
TAPEPAK,100P,.025
QFP100,.63SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, GUARD RING
FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
4.8 mm
1.6 mm
Speed
25 MHz
25 MHz
Supply Current-Max
190 mA
300 mA
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn) - annealed
Terminal Form
FLAT
GULL WING
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
19 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare NG80386SX-25/F with alternatives
Compare 79R3041-25PFG8 with alternatives