NE58633BS,115
vs
MAX9725BEBC+T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
QFN
|
BGA
|
| Package Description |
HVQCCN, LCC32,.2SQ,20
|
VFBGA, BGA12,3X4,20
|
| Pin Count |
32
|
12
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
20 kHz
|
22 kHz
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Gain |
25 dB
|
|
| JESD-30 Code |
S-PQCC-N32
|
R-PBGA-B12
|
| JESD-609 Code |
e4
|
e1
|
| Length |
5 mm
|
2.02 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
12
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Power-Nom |
0.04 W
|
0.025 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
BGA12,3X4,20
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
0.67 mm
|
| Supply Current-Max |
11 mA
|
3.3 mA
|
| Supply Voltage-Max (Vsup) |
1.7 V
|
1.8 V
|
| Supply Voltage-Min (Vsup) |
0.9 V
|
0.9 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
5 mm
|
1.54 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Technology |
|
BICMOS
|
|
|
|
Compare NE58633BS,115 with alternatives
Compare MAX9725BEBC+T with alternatives