NE556F vs ICM7556IPD-2 feature comparison

NE556F General Electric Solid State

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ICM7556IPD-2 Maxim Integrated Products

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE MAXIM INTEGRATED PRODUCTS INC
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDIP-T14
JESD-609 Code e0 e0
Number of Terminals 14 14
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 5 1
Pbfree Code No
Part Package Code DIP
Pin Count 14
Analog IC - Other Type SQUARE
Length 19.05 mm
Moisture Sensitivity Level 1
Number of Functions 1
Output Frequency-Max 0.5 MHz
Seated Height-Max 4.572 mm
Supply Current-Max (Isup) 0.6 mA
Supply Voltage-Max (Vsup) 16 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm

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