NE556-1F
vs
LM556CN
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP, DIP14,.3
|
PLASTIC, DIP-14
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-XDIP-T14
|
R-PDIP-T14
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
10
|
4
|
| Analog IC - Other Type |
|
PULSE; RECTANGULAR
|
| Length |
|
19.18 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
|
16 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
7.62 mm
|
|
|
|
Compare NE556-1F with alternatives
Compare LM556CN with alternatives