NE5517N
vs
NE5517AN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
DIP
Package Description
0.300 INCH, PLASTIC, SOT38-4, DIP-16
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
TRANSCONDUCTANCE
TRANSCONDUCTANCE
Average Bias Current-Max (IIB)
8 µA
Bias Current-Max (IIB) @25C
5 µA
5 µA
Common-mode Reject Ratio-Nom
110 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
5000 µV
5000 µV
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
Length
19.025 mm
Low-Offset
NO
NO
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
-22 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
Slew Rate-Nom
50 V/us
Supply Current-Max
4 mA
4 mA
Supply Voltage Limit-Max
22 V
22 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
2000
Width
7.62 mm
Base Number Matches
3
3
JESD-609 Code
e0
Packing Method
TUBE
Terminal Finish
Tin/Lead (Sn/Pb)
Compare NE5517N with alternatives