NE5517N
vs
LM13700N
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
DIP
|
DIP
|
Package Description |
0.300 INCH, PLASTIC, SOT38-4, DIP-16
|
PLASTIC, DIP-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
TRANSCONDUCTANCE
|
TRANSCONDUCTANCE
|
Average Bias Current-Max (IIB) |
8 µA
|
8 µA
|
Bias Current-Max (IIB) @25C |
5 µA
|
5 µA
|
Common-mode Reject Ratio-Nom |
110 dB
|
110 dB
|
Frequency Compensation |
YES
|
YES
|
Input Offset Voltage-Max |
5000 µV
|
4000 µV
|
JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
Length |
19.025 mm
|
21.755 mm
|
Low-Offset |
NO
|
NO
|
Moisture Sensitivity Level |
1
|
1
|
Neg Supply Voltage Limit-Max |
-22 V
|
-18 V
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.2 mm
|
5.08 mm
|
Slew Rate-Nom |
50 V/us
|
50 V/us
|
Supply Current-Max |
4 mA
|
|
Supply Voltage Limit-Max |
22 V
|
18 V
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Unity Gain BW-Nom |
2000
|
2000
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
1
|
4
|
Common-mode Reject Ratio-Min |
|
80 dB
|
JESD-609 Code |
|
e0
|
Packing Method |
|
RAIL
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare NE5517N with alternatives
Compare LM13700N with alternatives