NE5517AN
vs
NE5517N
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ONSEMI
|
| Part Package Code |
DIP
|
PDIP-16
|
| Package Description |
DIP, DIP16,.3
|
DIP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
TRANSCONDUCTANCE
|
TRANSCONDUCTANCE
|
| Average Bias Current-Max (IIB) |
7 µA
|
8 µA
|
| Bias Current-Max (IIB) @25C |
5 µA
|
5 µA
|
| Common-mode Reject Ratio-Nom |
110 dB
|
110 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
5000 µV
|
5000 µV
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
| Length |
19.025 mm
|
19.175 mm
|
| Low-Offset |
NO
|
NO
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
-22 V
|
-22 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.2 mm
|
4.4 mm
|
| Slew Rate-Nom |
50 V/us
|
50 V/us
|
| Supply Current-Max |
4 mA
|
4 mA
|
| Supply Voltage Limit-Max |
22 V
|
22 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
2000
|
2000
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
No
|
| Manufacturer Package Code |
|
648-08
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| JESD-609 Code |
|
e0
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare NE5517AN with alternatives
Compare NE5517N with alternatives