NE530FE vs SG741SCM feature comparison

NE530FE NXP Semiconductors

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SG741SCM Linfinity Microelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS LINFINITY MICROELECTRONICS
Part Package Code DIP
Package Description DIP, DIP, DIP8,.3
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.2 µA
Common-mode Reject Ratio-Nom 90 dB
Input Offset Voltage-Max 7000 µV 7500 µV
JESD-30 Code R-GDIP-T8 R-PDIP-T8
Length 9.955 mm
Neg Supply Voltage Limit-Max -18 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Slew Rate-Nom 35 V/us
Supply Voltage Limit-Max 18 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 3000
Width 7.62 mm
Base Number Matches 4 1
Rohs Code No
Architecture VOLTAGE-FEEDBACK
Frequency Compensation YES
JESD-609 Code e0
Low-Offset NO
Slew Rate-Min 10 V/us
Terminal Finish Tin/Lead (Sn/Pb)

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