NE530FE vs LM308H feature comparison

NE530FE NXP Semiconductors

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LM308H National Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, METAL CAN, TO-5, 8 PIN
Pin Count 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.2 µA 0.01 µA
Common-mode Reject Ratio-Nom 90 dB 100 dB
Input Offset Voltage-Max 7000 µV 10000 µV
JESD-30 Code R-GDIP-T8 O-MBCY-W8
Length 9.955 mm
Neg Supply Voltage Limit-Max -18 V -18 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material CERAMIC, GLASS-SEALED METAL
Package Code DIP TO-5
Package Equivalence Code DIP8,.3 CAN8,.2
Package Shape RECTANGULAR ROUND
Package Style IN-LINE CYLINDRICAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Slew Rate-Nom 35 V/us 0.3 V/us
Supply Voltage Limit-Max 18 V 18 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE WIRE
Terminal Pitch 2.54 mm
Terminal Position DUAL BOTTOM
Unity Gain BW-Nom 3000 1000
Width 7.62 mm
Base Number Matches 4 12
Rohs Code No
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 0.007 µA
Common-mode Reject Ratio-Min 80 dB
Frequency Compensation NO
JESD-609 Code e0
Low-Offset NO
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Supply Current-Max 0.8 mA
Terminal Finish Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s) 40
Voltage Gain-Min 15000

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