NE47F512-300 vs MFM864JI-30 feature comparison

NE47F512-300 LSI Corporation

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MFM864JI-30 APTA Group Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SEEQ TECHNOLOGY INC APTA GROUP INC
Package Description QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.45X.7
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 300 ns 300 ns
Additional Feature 100 ERASE/PROGRAM CYCLES; DATA RETENTION > 10 YEARS
Command User Interface NO NO
Data Polling NO NO
Data Retention Time-Min 10
JESD-30 Code R-PQCC-J32 R-XQCC-J32
JESD-609 Code e0 e0
Memory Density 524288 bit 524288 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1
Number of Terminals 32 32
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX8 64KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code QCCJ QCCJ
Package Equivalence Code LDCC32,.5X.6 LDCC32,.45X.7
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0004 A 0.0001 A
Supply Current-Max 0.04 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Toggle Bit NO NO
Type NOR TYPE NOR TYPE
Base Number Matches 1 2
Endurance 1000 Write/Erase Cycles
Number of Sectors/Size 128
Sector Size 512

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