NE1619DS,112
vs
NE1619DS
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
SSOP1
|
|
| Package Description |
PLASTIC, SSOP-16
|
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
SOT519-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
|
| JESD-30 Code |
R-PDSO-G16
|
|
| JESD-609 Code |
e4
|
|
| Length |
4.9 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
120 °C
|
120 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
|
| Package Equivalence Code |
SSOP16,.25
|
SSOP16,.25
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.73 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
2.8 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.635 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Operating Current-Max |
|
0.5 mA
|
| Package Shape/Style |
|
RECTANGULAR
|
| Temperature Coefficient |
|
NEGATIVE/POSITIVE ppm/°C
|
|
|
|
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