NE1619DS,112 vs 935270142112 feature comparison

NE1619DS,112 NXP Semiconductors

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935270142112 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP1 SOIC
Package Description PLASTIC, SSOP-16 SSOP,
Pin Count 16 16
Manufacturer Package Code SOT519-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type ANALOG CIRCUIT ANALOG CIRCUIT
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 4.9 mm 4.9 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 120 °C 120 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.73 mm 1.73 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 2.8 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Rohs Code Yes
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 935270142112 with alternatives