NE1617DS
vs
ADM1021AARQZ-REEL7
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ANALOG DEVICES INC
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
Length |
4.9 mm
|
4.9022 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
100 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
SSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.73 mm
|
1.7526 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
3.9116 mm
|
Base Number Matches |
4
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SSOP
|
Package Description |
|
LEAD FREE, MO-137AB, QSOP-16
|
Pin Count |
|
16
|
Additional Feature |
|
PROGRAMMABLE OVER/UNDER TEMPERATURE LIMITS, ON-CHIP AND REMOTE TEMPERATURE SENSING
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Supply Voltage-Nom (Vsup) |
|
3.3 V
|
Terminal Finish |
|
Matte Tin (Sn) - annealed
|
|
|
|
Compare NE1617DS with alternatives
Compare ADM1021AARQZ-REEL7 with alternatives