NDD03N60Z
vs
FQD3N60CTM-WS
feature comparison
| Part Life Cycle Code |
Active
|
End Of Life
|
| Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
TO-252 3L (DPAK)
|
| Package Description |
|
PLASTIC, DPAK-3/2
|
| Manufacturer Package Code |
|
369AS
|
| Samacsys Manufacturer |
|
onsemi
|
| Avalanche Energy Rating (Eas) |
|
150 mJ
|
| Case Connection |
|
DRAIN
|
| Configuration |
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
|
600 V
|
| Drain Current-Max (ID) |
|
2.4 A
|
| Drain-source On Resistance-Max |
|
3.4 Ω
|
| FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
| JEDEC-95 Code |
|
TO-252AA
|
| JESD-30 Code |
|
R-PSSO-G2
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Mode |
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
|
150 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Polarity/Channel Type |
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
|
50 W
|
| Pulsed Drain Current-Max (IDM) |
|
9.6 A
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
SINGLE
|
| Transistor Application |
|
SWITCHING
|
| Transistor Element Material |
|
SILICON
|
|
|
|
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