NCP605MNADJT2G
vs
LP38693MPX-ADJ/NOPB
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
End Of Life
|
Transferred
|
Ihs Manufacturer |
ONSEMI
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
DFN6, 3x3.3x0.9mm, 0.95mm Pitch
|
|
Package Description |
DFN-6
|
|
Pin Count |
6
|
|
Manufacturer Package Code |
506AX
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
2 Days
|
|
Samacsys Manufacturer |
onsemi
|
|
Adjustability |
ADJUSTABLE
|
ADJUSTABLE
|
Dropout Voltage1-Max |
0.47 V
|
|
Dropout Voltage1-Nom |
0.45 V
|
0.43 V
|
JESD-30 Code |
R-XDSO-N6
|
|
JESD-609 Code |
e3
|
e3
|
Length |
3.3 mm
|
|
Line Regulation-Max (%/V) |
0.00003
|
0.1
|
Load Regulation-Max(%) |
2.4%
|
5%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
|
Number of Outputs |
1
|
1
|
Number of Terminals |
6
|
5
|
Operating Temperature TJ-Max |
150 °C
|
125 °C
|
Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
Output Current1-Max |
0.5 A
|
0.5 A
|
Output Voltage1-Max |
5 V
|
9 V
|
Output Voltage1-Min |
1.25 V
|
1.25 V
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
|
Package Equivalence Code |
SOLCC6,.13,38
|
SOT-223-5
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulator Type |
ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
|
|
Seated Height-Max |
0.9 mm
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.95 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
3 mm
|
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
|
|
|