NCD330J3KVNPODF
vs
NCD330J3KVNPODTBF
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NIC COMPONENTS CORP
|
NIC COMPONENTS CORP
|
Package Description |
,
|
,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8532.23.00.60
|
8532.23.00.60
|
Capacitance |
0.000033 µF
|
0.000033 µF
|
Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
Dielectric Material |
CERAMIC
|
CERAMIC
|
Height |
10 mm
|
10 mm
|
JESD-609 Code |
e3
|
e3
|
Length |
10 mm
|
10 mm
|
Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
Multilayer |
Yes
|
Yes
|
Negative Tolerance |
5%
|
5%
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-30 °C
|
Package Shape |
DISK PACKAGE
|
DISK PACKAGE
|
Package Style |
Radial
|
Radial
|
Positive Tolerance |
5%
|
5%
|
Rated (DC) Voltage (URdc) |
3000 V
|
3000 V
|
Surface Mount |
NO
|
NO
|
Temperature Characteristics Code |
C0G
|
C0G
|
Temperature Coefficient |
30ppm/Cel ppm/°C
|
30ppm/Cel ppm/°C
|
Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
Terminal Shape |
WIRE
|
WIRE
|
Base Number Matches |
1
|
1
|
Packing Method |
|
AMMO PACK
|
|
|
|
Compare NCD330J3KVNPODF with alternatives
Compare NCD330J3KVNPODTBF with alternatives