NC7WZ00L8X
vs
74HCT2G32DP,125
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
MICROPAK MLP
TSSOP
Package Description
1.60 MM, LEAD FREE, MO-255UAAD, MICROPAK-8
3 MM, PLASTIC, SOT505-2, TSSOP-8
Pin Count
8
8
Manufacturer Package Code
8LD,MICROPAK, JEDEC MO-255, VARIATION UAAD, 1.6MM SQUARE
SOT505-2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
HCT
JESD-30 Code
S-XQCC-N8
S-PDSO-G8
JESD-609 Code
e4
e4
Length
1.6 mm
3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
OR GATE
Max I(ol)
0.024 A
0.004 A
Moisture Sensitivity Level
1
1
Number of Functions
2
2
Number of Inputs
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VQCCN
TSSOP
Package Equivalence Code
LCC8,.06SQ,20
TSSOP8,.16
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
4.9 ns
36 ns
Propagation Delay (tpd)
9.8 ns
36 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
0.55 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
4.5 V
Supply Voltage-Nom (Vsup)
1.8 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.6 mm
3 mm
Base Number Matches
2
2
Factory Lead Time
4 Weeks
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