NC7SP17L6X
vs
74LVC1G02GF
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SON
|
SON
|
| Package Description |
VSON,
|
1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
unknown
|
compliant
|
| Family |
P
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-N6
|
S-PDSO-N6
|
| JESD-609 Code |
e4
|
e3
|
| Length |
1.45 mm
|
1 mm
|
| Logic IC Type |
BUFFER
|
NOR GATE
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
1
|
2
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
VSON
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
46.3 ns
|
10.5 ns
|
| Seated Height-Max |
0.55 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
0.9 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.1 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL GOLD
|
Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.35 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1 mm
|
1 mm
|
| Base Number Matches |
3
|
2
|
| HTS Code |
|
8542.39.00.01
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.024 A
|
| Package Equivalence Code |
|
SOLCC6,.04,14
|
| Packing Method |
|
TR
|
| Prop. Delay@Nom-Sup |
|
6 ns
|
| Qualification Status |
|
Not Qualified
|
| Schmitt Trigger |
|
NO
|
|
|
|
Compare 74LVC1G02GF with alternatives