NC7S32P5
vs
74HC1G32GW-Q100H
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
TSSOP
Package Description
TSSOP,
1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1,TSSOP-5
Pin Count
5
5
Reach Compliance Code
unknown
compliant
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e3
e3
Length
2 mm
2.05 mm
Logic IC Type
OR GATE
OR GATE
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
125 ns
135 ns
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
1.25 mm
1.25 mm
Base Number Matches
3
2
Manufacturer Package Code
SOT353-1
Load Capacitance (CL)
50 pF
Max I(ol)
0.002 A
Package Equivalence Code
TSSOP5/6,.08
Packing Method
TR
Prop. Delay@Nom-Sup
27 ns
Schmitt Trigger
NO
Screening Level
AEC-Q100