NB2308AI5HDG
vs
23S08E-5HPGI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ONSEMI
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
SOIC
TSSOP
Package Description
LEAD FREE, SOIC-16
SOP, TSSOP16,.25
Pin Count
16
16
Manufacturer Package Code
751B-05
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
2308
23S
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e3
e0
Length
9.9 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.012 A
0.012 A
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
16
16
Number of True Outputs
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
TSSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
240
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.2 ns
0.2 ns
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.635 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
20
Width
3.9 mm
fmax-Min
15 MHz
100 MHz
Base Number Matches
1
1
Compare NB2308AI5HDG with alternatives
Compare 23S08E-5HPGI with alternatives