NB2308AI4DG
vs
23S08E-4DCG8
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP16,.25
|
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
751B-05
|
DCG16
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542390000
|
| Family |
2308
|
|
| Input Conditioning |
STANDARD
|
|
| JESD-30 Code |
R-PDSO-G16
|
|
| JESD-609 Code |
e3
|
e3
|
| Length |
9.9 mm
|
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Max I(ol) |
0.008 A
|
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
16
|
|
| Number of True Outputs |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Same Edge Skew-Max (tskwd) |
0.2 ns
|
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN
|
TIN
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
|
| fmax-Min |
15 MHz
|
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
NLR
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
|
|
|
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