NB2308AI4D
vs
NB2308AC4DR2G
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
ON SEMICONDUCTOR
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP, SOP16,.25
|
SOP, SOP16,.25
|
Pin Count |
16
|
16
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
2308
|
2308
|
Input Conditioning |
STANDARD
|
STANDARD
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
e3
|
Length |
9.9 mm
|
9.9 mm
|
Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
Max I(ol) |
0.008 A
|
0.008 A
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
16
|
16
|
Number of True Outputs |
8
|
8
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP16,.25
|
SOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
235
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.2 ns
|
0.2 ns
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
3.9 mm
|
fmax-Min |
133.3 MHz
|
133.3 MHz
|
Base Number Matches |
1
|
1
|
Moisture Sensitivity Level |
|
1
|
|
|
|
Compare NB2308AI4D with alternatives
Compare NB2308AC4DR2G with alternatives