NB100LVEP56MNR2
vs
NB100LVEP56DTR2G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ONSEMI
ON SEMICONDUCTOR
Part Package Code
QFN
TSSOP
Package Description
4 X 4 MM, QFN-24
TSSOP, TSSOP20,.25
Pin Count
24
20
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
4 Weeks
Additional Feature
NECL MODE: VCC = 0V WITH VEE = -2.375V TO -5.5V
NECL MODE: VCC = 0V WITH VEE = -2.375V TO -5.5V
Family
100LVE
100LVE
JESD-30 Code
S-XQCC-N24
R-PDSO-G20
JESD-609 Code
e0
e4
Length
4 mm
6.5 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
2
2
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
24
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
TSSOP
Package Equivalence Code
LCC24,.16SQ,20
TSSOP20,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
235
260
Power Supply Current-Max (ICC)
65 mA
65 mA
Prop. Delay@Nom-Sup
0.7 ns
0.7 ns
Propagation Delay (tpd)
0.65 ns
0.65 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
DUAL
Width
4 mm
4.4 mm
Base Number Matches
2
1
Pbfree Code
Manufacturer Package Code
9.48
Moisture Sensitivity Level
1
Time@Peak Reflow Temperature-Max (s)
30
Compare NB100LVEP56MNR2 with alternatives
Compare NB100LVEP56DTR2G with alternatives