NB100LVEP56MN
vs
NB100LVEP56DTR2
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFN
|
TSSOP
|
| Package Description |
4 X 4 MM, QFN-24
|
LEAD FREE, PLASTIC, TSSOP-20
|
| Pin Count |
24
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -2.375V TO -5.5V
|
NECL MODE: VCC = 0V WITH VEE = -2.375V TO -5.5V
|
| Family |
100LVE
|
100LVE
|
| JESD-30 Code |
S-XQCC-N24
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
e4
|
| Length |
4 mm
|
6.5 mm
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Number of Functions |
2
|
2
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
24
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Propagation Delay (tpd) |
0.65 ns
|
0.65 ns
|
| Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
4 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
|
|
|