NAND512W3B3CN6F
vs
HY27US16121A-SPMP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
SK HYNIX INC
Part Package Code
TSOP
SOIC
Package Description
TSOP1,
VSSOP,
Pin Count
48
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
35 ns
30 ns
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e3
Length
18.4 mm
15.4 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
67108864 words
33554432 words
Number of Words Code
64000000
32000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-30 °C
Organization
64MX8
32MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
VSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3.3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
0.65 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
12 mm
12 mm
Base Number Matches
1
1
Pbfree Code
Peak Reflow Temperature (Cel)
260
Supply Current-Max
0.02 mA
Time@Peak Reflow Temperature-Max (s)
20
Type
SLC NAND TYPE
Compare NAND512W3B3CN6F with alternatives
Compare HY27US16121A-SPMP with alternatives