NAND512W3A2CV1F
vs
NAND512W3B3CN1T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
SOIC
TSOP
Package Description
VSSOP,
TSOP1,
Pin Count
48
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
35 ns
35 ns
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
Length
15.4 mm
18.4 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64MX8
64MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.65 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
SLC NAND TYPE
Width
12 mm
12 mm
Base Number Matches
2
2
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare NAND512W3A2CV1F with alternatives
Compare NAND512W3B3CN1T with alternatives