NAND512R3B2CZA6E vs NAND512R3B2AZA1T feature comparison

NAND512R3B2CZA6E Numonyx Memory Solutions

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NAND512R3B2AZA1T STMicroelectronics

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NUMONYX STMICROELECTRONICS
Part Package Code BGA BGA
Package Description TFBGA, TFBGA, BGA63,10X12,32
Pin Count 63 63
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 25000 ns 25000 ns
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e1 e0
Length 12 mm 12 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64MX8 64MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.05 mm 1.05 mm
Supply Current-Max 0.015 mA 0.015 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NAND TYPE
Width 9.5 mm 9.5 mm
Base Number Matches 2 2
Command User Interface YES
Data Polling NO
Number of Sectors/Size 512
Package Equivalence Code BGA63,10X12,32
Page Size 2K words
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.00005 A
Toggle Bit NO

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